| Parameter | Flex and Rigid-Flex Circuits |
| Line width/space | 40/40 µm |
| PTH (laser) | 30 µm |
| Blind vias (laser) | 40 µm |
| PTH (mechanical) | 150 µm |
| Blind vias (mechanical) | 200 µm |
| Pad diameter | via diameter + 0.25 mm |
| Min. thickness | 25 µm |
| Max. thickness | 2.5 mm |
| Max. panel size | 457 x 305 mm |
| Max. board size | 415 x 270 mm |
| Number of layers | up to 6 (8 for rigid-flex) |
| Soldermask thickness | 20 ± 5 µm |
| Electrical Test | 100 % |
| Optical Test | 100 % |
Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!
