We produce medium to large series of flexible, rigid-flexible and rigid multilayer PCBs and MCM-Ls using HDI/microvia technology.
We also provide double-layer flexible substrates with microvias using reel-to-reel technology.
Our solutions fulfill the requirements of advanced applications with high-end IC packages: FC, COF, MCM, COB, CSP, BGA, µBGA and TAB.
The variety of applications realized over many years using various base materials as well as very thin layer thicknesses – down to 12.5 µm – provides a solid basis for advising you on the best solution.
We use the most innovative materials to provide you with even more economic and efficient solutions. In many projects we have also used LCP (Liquid Crystal Polymers), carbon fiber or even ceramic combinations.
