Cicorel

Cicor Technologies Company

Main Capabilities - Reel-to-Reel

Parameter 1 layer 2 layers
Line width/space 35/35 µm 90/90 µm
Alignement between sides - ± 50 µm
PTH (laser) - 100 µm
Blind vias (laser) - 120 µm
PTH (mechanical) 0.3 mm (stamped) -
Blind vias (mechanical) 0.3 mm (stamped) -
Pad diameter via diameter + 0.15 mm via diameter + 0.2 mm
Min. thickness 25 µm 25 µm
Max. thickness 0.22 mm 0.22 mm
Reel size 150 m 150 m
Max. board size 150 x 180 mm 150 x 152 mm
Number of layers 1 2
Soldermask thickness 20 ± 5 µm 20 ± 5 µm
Electrical Test 100 % 100 %
Optical Test 100 % 100 %

Our capabilities are constantly evolving.

Do not hesitate to contact us if your application isn't within this range!

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