| Parameter | Boudry site | Moudon site |
| Line width/space | 40/40 µm | 80/80 µm |
| PTH (laser) | 100 µm | - |
| Blind vias (laser) | 75 µm | - |
| PTH (mechanical) | 150 µm | 200 µm |
| Blind vias (mechanical) | 200 µm | - |
| Pad diameter | via diameter + 0.30 mm | via diameter + 0.30 mm |
| Min. thickness | 50 µm | 100 µm |
| Max. thickness | 2.5 mm | 2.2 mm |
| Max. panel size | 610 x 457 mm | 410 x 260 mm |
| Max. board size | 570 x 410 mm | 390 x 240 mm |
| Number of layers | up to 8 | 1-2 |
| Nickel | 3-15 µm | 3-15 µm |
| Soft gold | flash to 1.2 µm | 0.1-1.2 µm, 80-120 HV |
| Hard gold | flash to 0.3 µm | 0.1-0.3 µm, 380-450 HV |
| Soldermask thickness | 20 ± 5 µm | 10-75 µm |
| Electrical Test | 100 % | - |
| AOI | 100 % | 100 % |
Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!
